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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60317-60-2 ; VDE 0474-317-60-2:2021-11 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60317-3 | 2004-08 | Specifications for particular types of winding wires - Part 3: Polyester enamelled round copper wire, class 155 More |
| IEC 60317-3 AMD 1 | 2010-11 | Specifications for particular types of winding wires - Part 3: Polyester enamelled round copper wire, class 155 More |
| IEC 60317-3 Edition 3.1 | 2011-02 | Specifications for particular types of winding wires - Part 3: Polyester enamelled round copper wire, class 155 More |
| IEC 60317-31 | 2015-10 | Specifications for particular types of winding wires - Part 31: Glass fibre wound, resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 180 More |
| IEC 60317-32 | 2015-10 | Specifications for particular types of winding wires - Part 32: Glass fibre wound, resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 155 More |
| IEC 60317-33 | 2015-10 | Specifications for particular types of winding wires - Part 33: Glass fibre wound, resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 200 More |
| IEC 60317-35 | 2013-10 | Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer More |
| IEC 60317-35 AMD 1 | 2019-06 | Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer More |
| IEC 60317-35 Edition 2.1 | 2019-06 | Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer More |
| IEC 60317-36 | 2013-10 | Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer More |
