NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61007 [CURRENT] references following documents:
Document number | Edition | Title |
---|---|---|
IEC 60068-2-58 AMD 1 | 2017-07 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
IEC 60068-2-58 Edition 4.1 | 2017-07 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
IEC 60068-2-60 | 2015-06 | Environmental testing - Part 2-60: Tests - Test Ke: Flowing mixed gas corrosion test More |
IEC 60068-2-61 | 1991-06 | Environmental testing; part 2: test methods; test Z/ABDM: climatic sequence More |
IEC 60068-2-64 | 2008-04 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broad-band random and guidance More |
IEC 60068-2-64 AMD 1 | 2019-10 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance; Amendment 1 More |
IEC 60068-2-64 Edition 2.1 | 2019-10 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance More |
IEC 60068-2-65 | 2013-02 | Environmental testing - Part 2-65: Tests - Test Fg: Vibration - Acoustically induced method More |
IEC 60068-2-66 | 1994-06 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) More |
IEC 60068-2-67 | 1995-12 | Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components More |