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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 62148-19 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-2X Corrigendum 1 | 2000-01 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 22 More |
| IEC 60191-2Y | 2000-06 | Mechanical standardization of semiconductor devices - Part 2: Dimensions (23rd Supplement to Publication 60191-2:1966) More |
| IEC 60191-2Z | 2000-09 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 24 More |
| IEC 60191-3 | 1999-10 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits More |
| IEC 60191-4 | 2013-10 | Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages More |
| IEC 60191-4 AMD 1 | 2018-03 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1 More |
| IEC 60191-4 Edition 3.1 | 2018-03 | Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages More |
| IEC 60191-5 | 1997-04 | Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB) More |
| IEC 60191-6 | 2009-11 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages More |
| IEC 60191-6-1 | 2001-10 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals More |
