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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 62149-10 ; VDE 0886-149-10:2020-04 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN IEC 62148-1 | 2019-02 | Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance (IEC 62148-1:2017); German version EN IEC 62148-1:2018 More |
| DIN EN 60068-2-27 ; VDE 0468-2-27:2010-02 | 2010-02 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock (IEC 60068-2-27:2008); German version EN 60068-2-27:2009 More |
| DIN EN 60068-2-47 | 2006-03 | Environmental testing - Part 2-47: Tests - Mounting of specimens for vibration, impact and similar dynamic tests (IEC 60068-2-47:2005); German version EN 60068-2-47:2005 More |
| DIN EN 60068-2-6 ; VDE 0468-2-6:2008-10 | 2008-10 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) (IEC 60068-2-6:2007); German version EN 60068-2-6:2008 More |
| DIN EN 60068-2-78 ; VDE 0468-2-78:2014-02 | 2014-02 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state (IEC 60068-2-78:2012); German version EN 60068-2-78:2013 More |
| DIN EN 60191-3 | 2000-07 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 More |
| DIN EN 60191-3 Beiblatt 1 | 2006-08 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms More |
| DIN EN 60191-4 | 2019-02 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018 More |
| DIN EN 60191-6 | 2010-06 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 More |
| DIN EN 60191-6-1 | 2002-08 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001 More |
