NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 61191-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61190-1-2 | 2014-02 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |
| IEC 61193-1 | 2001-12 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies More |
| IEC 61193-3 | 2013-01 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing More |
| IEC 62326-1 ; QC 230000:2002-03 | 2002-03 | Printed boards - Part 1: Generic specification More |
| IEC 62326-4 ; QC 230500:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification More |
| IPC EIA/JEDEC J-STD-002E ; IPC EIA/IPC/JEDEC J-STD-002E:2017-11-01 | 2017-11-01 | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires More |
| IPC J-STD-005A | 2012-02-14 | Requirements for Soldering Pastes More |
| IPC J-STD-006C ; IPC J-STD-006:2013-08-12 | 2013-08-12 | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications More |
| IPC OI-645 | 1993-10 | Standard for Visual Optical Inspection Aids More |
| IPC TM-650 | 2015-06-06 | TM-650: Test Methods Manual More |
