NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN IEC 61191-1 [CURRENT] references following documents:

Document number Edition Title
IEC 61190-1-2 2014-02 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More 
IEC 61193-1 2001-12 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies More 
IEC 61193-3 2013-01 Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing More 
IEC 62326-1 ; QC 230000:2002-03 2002-03 Printed boards - Part 1: Generic specification More 
IEC 62326-4 ; QC 230500:1996-12 1996-12 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification More 
IPC EIA/JEDEC J-STD-002E ; IPC EIA/IPC/JEDEC J-STD-002E:2017-11-01 2017-11-01 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires More 
IPC J-STD-006C ; IPC J-STD-006:2013-08-12 2013-08-12 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications More 
IPC OI-645 1993-10 Standard for Visual Optical Inspection Aids More 
IPC TM-650 2015-06-06 TM-650: Test Methods Manual More 
IPC 9191 1999-11-01 General Guidelines for Implementation of Statistical Process Control (SPC) More