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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60728-113 ; VDE 0855-113:2019-05 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 60068-2-66 | 1995-06 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) (IEC 60068-2-66:1994); German version EN 60068-2-66:1994 More |
| DIN EN 60068-2-68 | 1997-02 | Environmental testing - Part 2: Tests; test L: Dust and sand (IEC 60068-2-68:1994); German version EN 60068-2-68:1996 More |
| DIN EN 60068-2-7 | 1995-03 | Basic environmental testing procedures - Part 2: Tests; test Ga and guidance: Acceleration, steady state (IEC 60068-2-7:1983 + A1:1986); German version EN 60068-2-7:1993 More |
| DIN EN 60068-2-70 | 1996-07 | Environmental testing - Part 2: Tests - Test Xb: Abrasion of markings and letterings caused by rubbing of fingers and hands (IEC 60068-2-70:1995); German version EN 60068-2-70:1996 More |
| DIN EN 60068-2-75 ; VDE 0468-2-75:2015-08 | 2015-08 | Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests (IEC 60068-2-75:2014); German version EN 60068-2-75:2014 More |
| DIN EN 60068-2-77 | 1999-10 | Environmental testing - Part 2-77: Tests; test 77: Body strength and impact shock (IEC 60068-2-77:1999); German version EN 60068-2-77:1999 More |
| DIN EN 60068-2-78 ; VDE 0468-2-78:2014-02 | 2014-02 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state (IEC 60068-2-78:2012); German version EN 60068-2-78:2013 More |
| DIN EN 60068-2-80 | 2006-05 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode (IEC 60068-2-80:2005); German version EN 60068-2-80:2005 More |
| DIN EN 60068-2-81 | 2004-07 | Environmental testing - Part 2-81: Tests - Test Ei: Shock - Shock response spectrum synthesis (IEC 60068-2-81:2003); German version EN 60068-2-81:2003 More |
| DIN EN 60068-2-83 | 2012-07 | Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011 More |
