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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60749-26 ; VDE 0884-749-26 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-38 | 2008-02 | Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory More |
| IEC 60749-4 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) More |
| IEC 60749-40 | 2011-07 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge More |
| IEC 60749-42 | 2014-08 | Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage More |
| IEC 60749-44 | 2016-07 | Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices More |
| IEC 60749-5 | 2017-04 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test More |
| IEC 60749-6 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature More |
| IEC 60749-7 | 2011-06 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases More |
| IEC 60749-8 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 1 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
