NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60749-26 ; VDE 0884-749-26 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-16 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) More |
| IEC 60749-19 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |
| IEC 60749-19 AMD 1 | 2010-07 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |
| IEC 60749-19 Edition 1.1 | 2010-11 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |
| IEC 60749-2 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure More |
| IEC 60749-2 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure More |
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 60749-22 | 2002-09 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
| IEC 60749-22 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
| IEC 60749-23 | 2004-02 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
