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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN IEC 60749-26 ; VDE 0884-749-26 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 60749-8 | 2003-12 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003 More |
| DIN EN 60749-9 | 2017-11 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017 More |
| IEC 60749-1 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-1 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-11 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-11 Corrigendum 1 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-11 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-12 | 2017-12 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency More |
| IEC 60749-13 | 2018-02 | Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere More |
| IEC 60749-14 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) More |
