NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60749-43 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 60749-23 | 2004-02 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
| IEC 60749-25 | 2003-07 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling More |
| IEC 60749-26 | 2018-01 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) More |
| IEC 60749-29 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test More |
| IEC 60749-42 | 2014-08 | Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage More |
| IEC 60749-5 | 2017-04 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test More |
| IEC 60749-6 | 2017-03 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature More |
| IEC 60068-2-1 | 2007-03 | Environmental testing - Part 2-1: Tests - Test A: Cold More |
| IEC 60068-2-30 | 2005-08 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) More |
