NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61587-1 ; VDE 0687-587-1:2018-03 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-69 | 2017-03 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method More |
| IEC 60068-2-7 | 1983 | Basic environmental testing procedures. Part 2 : Tests. Test Ga and guidance: Acceleration, steady state More |
| IEC 60068-2-7 AMD 1 | 1986 | Basic environmental testing procedures. Part 2 : Tests. Test Ga and guidance: Acceleration, steady state More |
| IEC 60068-2-70 | 1995-12 | Environmental testing - Part 2: Tests - Test Xb: Abrasion of markings and letterings caused by rubbing of fingers and hands More |
| IEC 60068-2-74 | 1999-06 | Environmental testing - Part 2: Tests - Test Xc: Fluid contamination More |
| IEC 60068-2-75 | 2014-09 | Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests More |
| IEC 60068-2-78 | 2012-10 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state More |
| IEC 60068-2-80 | 2005-05 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode More |
| IEC 60068-2-81 | 2003-07 | Environmental testing - Part 2-81: Tests; Test Ei: Shock; Shock response spectrum synthesis More |
| IEC 60068-2-83 | 2011-09 | Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste More |
