NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 60664-3 ; VDE 0110-3:2017-11 [CURRENT] references following documents:

Document number Edition Title
IEC 61249-2-27 2012-11 Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad More 
IEC 61249-2-30 2012-11 Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad More 
IEC 61249-2-31 2009-02 Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad More 
IEC 61249-2-32 2009-02 Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined permittivity (equal or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad More 
IEC 61249-2-33 2009-02 Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined permittivity (equal or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad More 
IEC 61249-2-34 2009-02 Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined permittivity (equal or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad More 
IEC 61249-2-35 2008-11 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials; clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More 
IEC 61249-2-36 2008-11 Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More 
IEC 61249-2-37 2008-11 Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More 
IEC 61249-2-38 2008-11 Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More