NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62435-1 ; VDE 0884-135-1:2017-10 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 62258-2 | 2011-12 | Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011 More |
| DIN EN 62258-5 | 2007-02 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006); German version EN 62258-5:2006 More |
| DIN EN 62258-6 | 2007-02 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 More |
| DIN EN 62402 | 2008-01 | Obsolescence management - Application guide (IEC 62402:2007); German version EN 62402:2007 More |
| DIN EN 62435-2 ; VDE 0884-135-2:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms (IEC 62435-2:2017); German version EN 62435-2:2017 More |
| DIN EN 62435-5 ; VDE 0884-135-5:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017); German version EN 62435-5:2017 More |
| EN 190000 | 1995-06 | Generic specification: Monolithic integrated circuits More |
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 62258-1 | 2009-04 | Semiconductor die products - Part 1: Procurement and use More |
| IEC 62258-2 | 2011-05 | Semiconductor die products - Part 2: Exchange data formats More |
