NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62435-5 ; VDE 0884-135-5:2017-10 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 62435-2 | 2017-01 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms More |
| DIN EN 60068-2-17 | 1995-05 | Environmental testing - Part 2: Tests - Test Q: Sealing (IEC 60068-2-17:1994); German version EN 60068-2-17:1994 More |
| DIN EN 60749-20-1 | 2009-10 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 More |
| DIN EN 60749-21 | 2012-01 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011 More |
| DIN EN 60749-22 | 2003-12 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003 More |
| DIN EN 61340-5-1 ; VDE 0300-5-1:2017-07 | 2017-07 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements (IEC 61340-5-1:2016); German version EN 61340-5-1:2016 More |
| DIN EN 62435-1 ; VDE 0884-135-1:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (IEC 62435-1:2017); German version EN 62435-1:2017 More |
| DIN EN 62435-2 ; VDE 0884-135-2:2017-10 | 2017-10 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms (IEC 62435-2:2017); German version EN 62435-2:2017 More |
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 60749-22 | 2002-09 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
