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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60068-3-13 ; VDE 0468-3-13:2017-04 [CURRENT] references following documents:
Document number | Edition | Title |
---|---|---|
IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
IEC 60068-2-83 | 2011-09 | Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste More |
IEC 62137-3 | 2011-11 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints More |
DIN EN 60068-2-83 | 2012-07 | Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011 More |
DIN EN 62137-3 | 2012-08 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012 More |
IEC 60068-2-1 | 2007-03 | Environmental testing - Part 2-1: Tests - Test A: Cold More |
IEC 60068-2-10 | 2005-06 | Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth More |
IEC 60068-2-2 | 2007-07 | Environmental testing - Part 2-2: Tests - Test B: Dry heat More |
IEC 60068-2-27 | 2008-02 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock More |
IEC 60068-2-30 | 2005-08 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) More |