NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62326-20 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-6 | 2007-12 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) More |
| IEC 60068-2-64 | 2008-04 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broad-band random and guidance More |
| IEC 60068-2-66 | 1994-06 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) More |
| IEC 60068-2-78 | 2012-10 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state More |
| IEC 60068-2-80 | 2005-05 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode More |
| IEC 61189-1 | 1997-03 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More |
| IEC 61189-11 | 2013-05 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys More |
| IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
| IEC 61189-3-913 | 2016-01 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
