NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62326-20 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61189-3 | 2007-10 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
| IEC 61249-2-6 | 2003-11 | Materials for printed boards and other interconnection structures - Part 2-6: Reinforced base materials, clad and unclad; Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad More |
| IEC 61249-2-7 | 2002-03 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More |
| IEC 62878-1-1 | 2015-05 | Device embedded substrate - Part 1-1: Generic specification - Test methods More |
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60068-2-1 | 2007-03 | Environmental testing - Part 2-1: Tests - Test A: Cold More |
| IEC 60068-2-2 | 2007-07 | Environmental testing - Part 2-2: Tests - Test B: Dry heat More |
| IEC 60068-2-30 | 2005-08 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) More |
| IEC 60068-2-53 | 2010-04 | Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
