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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-5-3 [CURRENT] references following documents:
Document number | Edition | Title |
---|---|---|
IEC 61190-1-2 | 2014-02 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |
IEC 61189-5 | 2006-08 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies More |
IEC 61189-6 | 2006-07 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies More |
ASTM D 1210 | 2005 | Standard Test Method for Fineness of Dispersion of Pigment-Vehicle Systems by Hegman-Type Gage More |
IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
IEC 61189-1 | 1997-03 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More |
IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
IEC 61189-3 | 2007-10 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
IEC 61249-2-7 | 2002-03 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More |