NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62137-4 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61188-5-8 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) More |
| IEC 61189-3 | 2007-10 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
| IEC 61189-5 | 2006-08 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-2 | 2014-02 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |
| IEC 62137-1-3 | 2008-11 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test More |
| IEC 62137-1-4 | 2009-01 | Surface mounting technology - Environmental and endurance test methods for surface-mount solder joints - Part 1-4: Cyclic bending test More |
