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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-2 ; VDE 0886-149-2:2015-03 [CURRENT] references following documents:
Document number | Edition | Title |
---|---|---|
DIN EN 60749-16 | 2003-09 | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003 More |
DIN EN 60749-19 | 2011-01 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 More |
DIN EN 60749-2 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002 More |
DIN EN 60749-20-1 | 2009-10 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 More |
DIN EN 60749-21 | 2012-01 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011 More |
DIN EN 60749-22 | 2003-12 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003 More |
DIN EN 60749-23 | 2011-07 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011 More |
DIN EN 60749-24 | 2004-09 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2004); German version EN 60749-24:2004 More |
DIN EN 60749-25 | 2004-04 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003 More |
DIN EN 60749-27 | 2013-04 | Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012 More |