NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-2 ; VDE 0886-149-2:2015-03 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| DIN EN 60191-6 | 2010-06 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 More |
| DIN EN 60191-6-1 | 2002-08 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001 More |
| DIN EN 60191-6-10 | 2004-05 | Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003 More |
| DIN EN 60191-6-12 | 2011-12 | Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011 More |
| DIN EN 60191-6-16 | 2007-11 | Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007 More |
| DIN EN 60191-6-17 | 2011-09 | Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011 More |
| DIN EN 60191-6-18 | 2010-08 | Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010 More |
| DIN EN 60191-6-19 | 2010-10 | Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010 More |
| DIN EN 60191-6-2 | 2002-09 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002 More |
| DIN EN 60191-6-20 | 2011-03 | Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010 More |
