NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-8 ; VDE 0886-149-8:2014-11 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-32 AMD 1 | 2010-07 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-32 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-32 Edition 1.1 | 2010-11 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-33 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave More |
| IEC 60749-34 | 2010-10 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling More |
| IEC 60749-35 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components More |
| IEC 60749-36 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state More |
| IEC 60749-38 | 2008-02 | Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory More |
| IEC 60749-40 | 2011-07 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge More |
| IEC 60749-42 | 2014-08 | Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage More |
