NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-8 ; VDE 0886-149-8:2014-11 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-6-4 | 2003-06 | Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) More |
| IEC 60191-6-5 | 2001-08 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) More |
| IEC 60191-6-6 | 2001-03 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term More |
| IEC 60191-6-8 | 2001-08 | Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) More |
| IEC 60747-5-1 | 1997-08 | Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General More |
| IEC 60749-1 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-1 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-11 Corrigendum 1 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-11 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
| IEC 60749-14 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) More |
