NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62148-17 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-6-4 | 2003-06 | Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) More |
| IEC 60191-6-5 | 2001-08 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) More |
| IEC 60191-6-6 | 2001-03 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term More |
| IEC 60191-6-8 | 2001-08 | Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) More |
| IEC 60825-1 | 2014-05 | Safety of laser products - Part 1: Equipment classification and requirements More |
| IEC 62007-2 | 2009-01 | Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods More |
| ITU-T G.693 | 2009-11 | Optical interfaces for intra-office systems More |
