NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN IEC/TS 62647-1 ; DIN SPEC 42647-1:2013-07 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC/TS 62647-2 | 2012-11 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin More |
| ARINC 671 | 2006-03 | Guidance for the Transition to Lead-Free Soldering, Maintenance, and Repair More |
| GEIA-HB-0005-1 | 2006-06 | Program Management/Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics More |
| GEIA-HB-0005-2 | 2007-10 | Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes More |
| GEIA-HB-0005-3 | 2008-09 | Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems More |
| GEIA-HB-649 | 2005-10 | Implementation Guide for Configuration Management More |
| IEC 60068-2-1 | 2007-03 | Environmental testing - Part 2-1: Tests - Test A: Cold More |
| IEC 61188-5-1 | 2002-07 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IPC 2225 ; ANSI/IPC-2225 | 1998-05 | Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies More |
