NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-7 ; VDE 0886-149-7:2013-02 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-2V | 1998-12 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 20 More |
| IEC 60191-2W | 1999-07 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 21 More |
| IEC 60191-2X | 1999-09 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 22 More |
| IEC 60191-2X Corrigendum 1 | 2000-01 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 22 More |
| IEC 60191-2Y | 2000-06 | Mechanical standardization of semiconductor devices - Part 2: Dimensions (23rd Supplement to Publication 60191-2:1966) More |
| IEC 60191-2Z | 2000-09 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 24 More |
| IEC 60191-3 | 1999-10 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits More |
| IEC 60191-5 | 1997-04 | Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB) More |
| IEC 60191-6 | 2009-11 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages More |
| IEC 60191-6-1 | 2001-10 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals More |
