NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-7 ; VDE 0886-149-7:2013-02 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60793-2-60 | 2008-02 | Optical fibres - Part 2-60: Product specifications - Sectional specification for category C singles-mode intraconnection fibres More |
| IEC 61300-2-19 | 2012-11 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-19: Tests - Damp heat (steady state) More |
| IEC 61300-2-48 | 2009-03 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-48: Tests - Temperature-humidity cycling More |
| DIN EN 60749-1 | 2003-12 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003 More |
| DIN EN 60749-11 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002 More |
| DIN EN 60749-14 | 2004-07 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003 More |
| DIN EN 60749-16 | 2003-09 | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003 More |
| DIN EN 60749-19 | 2011-01 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 More |
| DIN EN 60749-2 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002 More |
| DIN EN 60749-20-1 | 2009-10 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 More |
