NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-7 ; VDE 0886-149-7:2013-02 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-6-20 | 2010-08 | Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) More |
| IEC 60191-6-21 | 2010-08 | Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) More |
| IEC 60191-6-3 | 2000-09 | Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP) More |
| IEC 60191-6-4 | 2003-06 | Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) More |
| IEC 60191-6-5 | 2001-08 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) More |
| IEC 60191-6-6 | 2001-03 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term More |
| IEC 60191-6-8 | 2001-08 | Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) More |
| IEC 60747-5-1 | 1997-08 | Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General More |
| IEC 60874-1 | 2011-11 | Fibre optic interconnecting devices and passive components - Connectors for optical fibres and cables - Part 1: Generic specification More |
| IEC 60874-1-1 | 2011-11 | Fibre optic interconnecting devices and passive components - Connectors for optical fibres and cables - Part 1-1: Blank detail specification More |
