NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60352-5 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61249-4-16 | 2009-05 | Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More |
| IEC 61249-4-17 | 2009-05 | Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More |
| IEC 61249-4-2 | 2005-09 | Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability More |
| IEC 61249-4-5 | 2005-09 | Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability More |
| IEC 61249-5-1 | 1995-11 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) More |
| IEC 61249-5-4 | 1996-06 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks More |
| IEC 61249-7-1 | 1995-04 | Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper More |
| IEC 61249-8-7 | 1996-04 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks More |
| IEC 61249-8-8 | 1997-06 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings More |
| IEC Guide 109 | 2012-06 | Environmental aspects - Inclusion in electrotechnical product standards More |
