NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62137-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61188-5-6 | 2003-01 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides More |
| IEC 61188-5-8 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) More |
| IEC 61249-2-7 | 2002-03 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More |
| IEC 60068-2-2 | 2007-07 | Environmental testing - Part 2-2: Tests - Test B: Dry heat More |
