NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60749-21 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-33 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave More |
| IEC 60749-34 | 2010-10 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling More |
| IEC 60749-35 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components More |
| IEC 60749-36 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state More |
| IEC 60749-38 | 2008-02 | Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory More |
| IEC 60749-40 | 2011-07 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge More |
| IEC 60749-7 | 2011-06 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases More |
| IEC 60749-8 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 1 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
