NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60749-21 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-21 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 60749-22 | 2002-09 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
| IEC 60749-22 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
| IEC 60749-23 | 2004-02 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
| IEC 60749-23 AMD 1 | 2011-01 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
| IEC 60749-23 Edition 1.1 | 2011-03 | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life More |
| IEC 60749-24 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST More |
| IEC 60749-25 | 2003-07 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling More |
| IEC 60749-27 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) More |
| IEC 60749-29 | 2011-04 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test More |
