NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60749-21 [CURRENT] references following documents:
Document number | Edition | Title |
---|---|---|
IEC 60068-4 AMD 2 | 1994-03 | Basic environmental testing procedures; part 4: information for specification writers; test summaries; amendment 2 More |
IEC 60068-5-2 | 1990-12 | Environmental testing; part 5: guide to drafting of test methods; terms and definitions More |
IEC 60749-1 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
IEC 60749-1 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
IEC 60749-11 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
IEC 60749-11 Corrigendum 1 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
IEC 60749-11 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method More |
IEC 60749-14 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) More |
IEC 60749-16 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) More |
IEC 60749-19 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |