NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 50155 ; VDE 0115-200:2008-03 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EN 61249-3-5 | 1999-04 | Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films (IEC 61249-3-5:1999) More |
| EN 61249-4-11 | 2005-10 | Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-11:2005) More |
| EN 61249-4-12 | 2005-10 | Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-12:2005) More |
| EN 61249-4-2 | 2005-10 | Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-2:2005) More |
| EN 61249-4-5 | 2005-10 | Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (IEC 61249-4-5:2005) More |
| EN 61249-5-1 | 1996-01 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995) More |
| EN 61249-5-4 | 1996-08 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks (IEC 61249-5-4:1996) More |
| EN 61249-7-1 | 1995-07 | Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper (IEC 61249-7-1:1995) More |
| EN 61249-8-7 | 1996-08 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks (IEC 61249-8-7:1996) More |
| EN 61249-8-8 | 1997-08 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings (IEC 61249-8-8:1997) More |
