NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61192-5 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61249-3-3 | 1999-02 | Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film More |
| IEC 61249-3-4 | 1999-02 | Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film More |
| IEC 61249-3-5 | 1999-02 | Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films More |
| IEC 61249-4-11 | 2005-09 | Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide woven E-glass prepreg of defined flammability More |
| IEC 61249-4-12 | 2005-09 | Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability More |
| IEC 61249-4-2 | 2005-09 | Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability More |
| IEC 61249-4-5 | 2005-09 | Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability More |
| IEC 61249-5-1 | 1995-11 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) More |
| IEC 61249-5-4 | 1996-06 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks More |
| IEC 61249-7-1 | 1995-04 | Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper More |
