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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 60027-2 [Withdrawn] references following documents:

Document number Edition Title
IEC 60748-11 ; QC 790100:1990-12 1990-12 Semiconductor devices; integrated circuits; part 11: sectional specification for semiconductor integrated circuits excluding hybrid circuits More 
IEC 60748-11 AMD 1 ; QC 790100:1995-06 1995-06 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits; Amendment 1 More 
IEC 60748-11 AMD 2 ; QC 790100:1999-04 1999-04 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits; Amendment 2 More 
IEC 60748-11-1 ; QC 790101:1992-04 1992-04 Semiconductor devices; integrated circuits; part 11; section 1: internal visual examination for semiconductor integrated circuits excluding hybrid circuits More 
IEC 60748-2 1997-12 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits More 
IEC 60748-20 ; QC 760000:1988 1988 Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits More 
IEC 60748-20 AMD 1 ; QC 760000:1995-09 1995-09 Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits; Amendment 1 More 
IEC 60748-20-1 ; QC 763000:1994-02 1994-02 Semiconductor devices; integrated circuits; part 20: generic specification for film integrated circuits and hybrid film integrated circuits; section 1: requirements for internal visual examination More 
IEC 60748-2-1 1991-10 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 1: blank detail specification for bipolar monolithic digital integrated circuits gates (excluding uncommitted logic arrays) More 
IEC 60748-21 ; QC 760100:1997-04 1997-04 Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure More