NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-2 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-32 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-33 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave More |
| IEC 60749-35 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components More |
| IEC 60749-36 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state More |
| IEC 60749-8 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 1 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
